SPBRC410 Emerson’s new compact, rugged industrial computer is built for the connection from the industrial floor to the cloud

Emerson today introduced the new PACSystems™ IPC 2010 compact Industrial Computer (IPC), a rugged industrial computer designed to handle a wide range of machine and discrete part manufacturing automation applications. The new solution serves manufacturing sites and OEM machine manufacturers who require rugged, compact, and durable IPC to cost-effectively support their Industrial Internet of Things
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SPFCS01 AMPLIMITE ULTRA-LITE 2.0 connector

With the rapid development of space technology, the performance requirements for connectors are also constantly improving. SPFCS01 Leveraging its extensive experience and expertise in aerospace engineering, TE Connectivity (" TE ") is introducing AMPLIMITE ULTRA-LITE 2.0 connector, an ultra-high performance, high density D-connector designed to meet the challenges of the extreme high altitude environment. This
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UFC911-B106 Schneider Electric x NVIDIA, Unlock the future of AI with the Smart Computing Center!

Schneider Electric, a global digital transformation specialist in energy management and automation, has announced a partnership with Nvidia to optimize data center infrastructure and advance edge artificial intelligence (AI) and digital twins. Based on rich industry practices in data center infrastructure and Nvidia's leading AI technology, Schneider Electric is launching the first publicly available Smart
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UFC092A-V1-HIEE300686R1 TE introduces 0.4mm fine pitch board-to-board connector

Nowadays, all kinds of smart devices are developing in the direction of small and compact, and the shrinking space and more stringent reliability requirements have also posed an upgrade challenge to the connector. Recently, TE Connectivity (" TE ") introduced a new fine pitch board-to-board connector UFC092A-V1-HIEE300686R1 NEW PRODUCT TE 0.4mm fine pitch board-to-board connector
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