IS400AEBMH1AJD associated with a printed circuit board

Substrate and thermal properties:
If the IS400AEBMH1AJD is associated with a printed circuit board or similar component, it may have a specific substrate, such as glass, that has a specific transition temperature (Tg), delamination at time 260°C (T260), and thermal decomposition temperature (TD) at 288°C (T288). These properties are essential to ensure the reliability and stability of the board at high temperatures.
Reliability test:
The product may have undergone a series of reliability tests to verify its performance under extreme temperature conditions. For example, a temperature cycle test of -40°C to +125°C may exceed 500 cycles, or a temperature cycle test of -40°C to +140°C may reach or exceed 1000 cycles. These tests help ensure that the product can withstand temperature changes in practical applications.

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Description

IS400AEBMH1AJD associated with a printed circuit board

Product Description

Substrate and thermal properties:
If the IS400AEBMH1AJD is associated with a printed circuit board or similar component, it may have a specific substrate, such as glass, that has a specific transition temperature (Tg), delamination at time 260°C (T260), and thermal decomposition temperature (TD) at 288°C (T288). These properties are essential to ensure the reliability and stability of the board at high temperatures.
Reliability test:
The product may have undergone a series of reliability tests to verify its performance under extreme temperature conditions. For example, a temperature cycle test of -40°C to +125°C may exceed 500 cycles, or a temperature cycle test of -40°C to +140°C may reach or exceed 1000 cycles. These tests help ensure that the product can withstand temperature changes in practical applications.
Performance characteristics:
IS400AEBMH1AJD may have the properties of a low-expansion material, which means that its expansion behavior in the Z-axis direction is well controlled when the temperature changes. This helps prevent barrel cracks, corner cracks, resin decay and other failure mechanisms, thereby increasing the reliability and durability of the product.
Application field:
Based on its possible thermal properties and reliability requirements, the IS400AEBMH1AJD may be suitable for applications that require high performance and reliability, such as automotive, aerospace, industrial manufacturing, etc. In these areas, equipment needs to withstand extreme temperatures, vibrations and other environmental factors, so the use of high-quality, highly reliable components is critical.

IS400TCASH1AGD

Product parameter

Size and weight:
Length, width, height (may be in millimeters).
Weight (may be in grams or kilograms).
Thermal performance:
Tg (glass transition temperature) : Usually between 150°C and 250°C.
Td (Thermal decomposition temperature) : may exceed 300°C.
CTE (Coefficient of thermal expansion) : The value of CTE in the Z-axis direction (thickness direction).
Electrical performance:
Insulation resistance: Resistance value usually measured under specific conditions.
Dielectric constant and dielectric loss: Parameters that measure the response of a material in an electric field.
Withstand voltage: can withstand the maximum voltage value.
Mechanical properties:
Bending strength: The ability of a material to resist breaking when bending.
Tensile strength: The ability of a material to resist breaking when stretched.
Hardness: A measure of a material’s ability to resist scratches or indentations.
Environmental adaptability:
Operating temperature range: the temperature range in which the product can work normally.
Storage temperature range: The temperature range at which the product can be safely stored.
Humidity adaptability: The performance of the product under different humidity conditions.
Reliability:
Temperature cycle number: The number of times the product can withstand the temperature cycle test.
Failure mechanism: how and why the product fails under different conditions.
Interfaces and connections:
Possible interface types (PCI, PCIe, USB, Ethernet, etc.).
Connector type, such as screws, fasteners, and pins.

Application field

Electronic Manufacturing:
This capacity is an electronic component or assembly used to manufacture various electronic devices such as smartphones, tablets, televisions, computers, etc. It is a circuit board, chip, connector, or other critical component.
Industrial Automation:
If the IS400AEBMH1AJD is related to industrial automation, it is a control module, sensor, actuator, or other device used to automate production lines. These devices are often used to monitor and control various parameters in the production process to improve production efficiency and product quality.
Automotive Electronics:
A large number of electronic components and components are used in automotive electronic systems. IS400AEBMH1AJD is a component for internal or external systems of a car, such as navigation systems, safety systems, entertainment systems, etc.
Aerospace:
In the aerospace sector, the demands on electronic components and assemblies are very high because they need to operate under extreme environmental conditions. If the IS400AEBMH1AJD has excellent performance and reliability, it is used in the manufacture of aircraft, satellites, rockets and other aerospace equipment.
Medical equipment:
A variety of electronic components and assemblies are also required in medical devices. The IS400AEBMH1AJD is a sensor, monitor, or other critical component used in medical devices to ensure the accuracy and reliability of medical devices.
Energy and Environmental Protection:
In the field of energy and environmental protection, electronic components and assemblies also play an important role. The IS400AEBMH1AJD is a component for energy conversion, energy management or environmental monitoring systems.

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