0190-01431 APPLIED MATERIALS ASSY

Brand: Applied Materials
Model: 0190-01431
Weight: 0.12kg
Operating temperature: 50°C to 200°C
Exposure time range: 1 second to 60 minutes
Chamber size: 600 x 600 x 600 mm (23.62 x 23.62 x 23.62 in)
Ultraviolet light source: mercury lamp
Radiation wavelength: 254 nm
Radiation intensity: up to 10 W/cm²
Protection class: IP30

Category:

Description

0190-01431 APPLIED MATERIALS ASSY

Product Description

0190-01431 is a component for semiconductor manufacturing equipment manufactured by Applied Materials, Inc. (AMAT). AMAT is a leading global supplier of semiconductor equipment whose products are used in all stages of semiconductor manufacturing.
Product features and functions
Precise temperature control: Maintain precise temperature control during curing and bonding.
Adjustable exposure time: Allows exposure time to be adjusted to optimize curing and bonding processes for specific materials and applications.
Robust and reliable construction: Robust and reliable construction for demanding semiconductor manufacturing environments.
Multiple interface options: Provide a variety of interface options, such as EtherNet/IP, Profinet, etc., to facilitate integration with different devices and systems.
High-speed data transmission: Supports high-speed data transmission to achieve fast and accurate data exchange and control.
Real-time: Support real-time operation and response, suitable for applications requiring high real-time.
Safety and reliability: It has safety and reliability functions to ensure the stability and operation safety of the system.

0190-01431

Product parameter

Brand: Applied Materials
Model: 0190-01431
Weight: 0.12kg
Operating temperature: 50°C to 200°C
Exposure time range: 1 second to 60 minutes
Chamber size: 600 x 600 x 600 mm (23.62 x 23.62 x 23.62 in)
Ultraviolet light source: mercury lamp
Radiation wavelength: 254 nm
Radiation intensity: up to 10 W/cm²
Protection class: IP30
Case material: ABS plastic, white, matte fine matte effect
Installation mode: Standard 86-box installation
Operating environment: indoor, temperature -10℃ to +55℃, relative humidity ≤95% (40℃±2℃ no condensation)

Application field

Semiconductor manufacturing: Used for photoresist curing, wafer bonding, microelectronics packaging, optical component manufacturing and medical device manufacturing.
Automatic production line: Control different types of equipment, such as motors, valves, actuators, etc., to achieve automatic operation of the system.
Medical devices: Bonding and curing materials used in medical device manufacturing.

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