3BHL000384P0101 | 5SHX0360D0001 5500V/360A dual IGBT-diode module

Parameter Name Parameter Value
IGBT Module ​5SHX0360D0001​
Driver Board ​3BHL000384P0101​
Blocking Voltage 5500V VCES
Nominal Current 360A IC @ 25°C
Short-Circuit Withstand 10kA @ 10μs
Switching Frequency ≤500 Hz (recommended)
Turn-off Time ≤1.8μs (with driver optimization)
Gate Driver Isolation 5kV RMS reinforced (IEC 62109)
Driver Interface Fiber optic receiver (ST connector)
Operating Temp -40°C to +125°C (Tvj max)
Thermal Resistance 0.08 K/W (junction-to-heatsink)
Mounting Interface Press-fit contact technology
dv/dt Rating ≤5000V/μs
Certifications UL E336879, IEC 60747-9
Category:

Description

Product Overview​
The ​​ABB 5SHX0360D0001​​ represents the pinnacle of high-power semiconductor technology, designed for ultra-reliable performance in medium-voltage drives (MVD) and HVDC systems. This 5500V/360A dual IGBT-diode module utilizes ABB’s proprietary HiPak press-pack technology, delivering unprecedented power density in critical energy conversion applications. When paired with its dedicated driver board ​​ABB 3BHL000384P0101​​, the system achieves seamless switching control with ≤1.8μs turn-off capability. The ​​5SHX0360D0001+3BHL000384P0101​​ combination forms the core of multilevel converters where efficiency exceeds 99% at MW-level power transfers, featuring integrated VCE(sat) monitoring and active clamping protection that reduces switching losses by 40% compared to standard IGBT solutions.


​## Technical Specifications​

Parameter Name Parameter Value
IGBT Module ​5SHX0360D0001​
Driver Board ​3BHL000384P0101​
Blocking Voltage 5500V VCES
Nominal Current 360A IC @ 25°C
Short-Circuit Withstand 10kA @ 10μs
Switching Frequency ≤500 Hz (recommended)
Turn-off Time ≤1.8μs (with driver optimization)
Gate Driver Isolation 5kV RMS reinforced (IEC 62109)
Driver Interface Fiber optic receiver (ST connector)
Operating Temp -40°C to +125°C (Tvj max)
Thermal Resistance 0.08 K/W (junction-to-heatsink)
Mounting Interface Press-fit contact technology
dv/dt Rating ≤5000V/μs
Certifications UL E336879, IEC 60747-9

​## Key Features and Advantages​
​Active Performance Optimization​
The driver board ​​3BHL000384P0101​​ implements adaptive gate control with temperature compensation, dynamically adjusting gate resistance to maintain optimal switching characteristics across -40°C to +125°C operation. Active clamping circuitry limits turn-off voltage spikes to ≤4200V, enabling 15% higher DC-link utilization than conventional designs.

​Predictive Failure Prevention​
Integrated VCE(sat) monitoring circuitry detects early IGBT degradation with ±3% accuracy. When the ​​5SHX0360D0001​​ exceeds preset saturation thresholds, the driver triggers tiered warnings via fiber optic interface, providing 200+ hours advanced notice before potential failure.

5SHX0845F0001

​Installation Revolution​
Spring-loaded press-fit contacts eliminate soldering requirements, reducing thermal stress during power cycling. Installation torque is precisely controlled at 8 N·m using ABB’s ​​T300​​ press tool, ensuring thermal resistance remains ≤0.08K/W over 100k thermal cycles.

​Safety Integration​
The driver board incorporates hardware interlocking (ISO 13849 PL e) that disables IGBT firing within 2μs upon safety signal loss. Dual power inputs allow redundancy with ≤5ms crossover time during supply failure.


​## Application Areas​
​Renewable Energy Converters​​: In 12MW wind turbine full-power converters, 12x ​​5SHX0360D0001​​ modules with ​​3BHL000384P0101​​ drivers enable ultra-low-loss switching, reducing annual energy losses by 230MWh per turbine.

​Electric Arc Furnace Control​​: Steel mills deploy this solution in thyristor bypass circuits to handle 150kA short-circuit currents, with driver boards positioned ≤20cm from IGBTs to prevent gate oscillation.

​HVDC Transmission Stations​​: For 500kV direct-current links, the system’s 5500V blocking voltage and press-pack reliability meet >99.999% availability requirements. Nuclear power applications leverage its IEEE 323 seismic certification.


​## System Components​

  1. ​5SXE1000-6​​ – Forced-cooled heatsink (thermal resistance 0.01K/W)
  2. ​5SNA2400K450300​​ – Snubber capacitor kit (reduces overvoltage 40%)
  3. ​3BHE039105P0105​​ – Fiber optic command receiver (duplicates driver inputs)
  4. ​5SHY4045L0003​​ – DC-link capacitor (optimized for high di/dt)
  5. ​1TGE120028R0200​​ – Thermal paste (8W/m·K conductivity)
  6. ​3BHL000387P0101​​ – Enhanced driver board (SiC hybrid support)
  7. ​5SGT50B4502​​ – Optically controlled gate test unit
  8. ​GDB1000​​ – Gate driver analyzer
  9. ​5SHX0260D0001​​ – Lower current option (260A version)
  10. ​3BHL000385P0101​​ – High-temperature driver variant

 

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