IC694ACC310 empty slot filling module DCS analog

IC694ACC310 Empty slot filler module

The IC694ACC310 Fanuc is an empty slot filler module built by B for GE RX3i PacSystem. GE RX3i PacSystem is a high performance control system consisting of modules that support the PacSystem engine. This rack-based system is built on the PCI standard to provide fast, consistent control between modules.

The empty IC694ACC310 module is primarily used for decorative purposes, as a placeholder or filler on the rack-based system of GE RX3i PacSystem. Modules can be filled with multiple blank slots on a rack to form a complete module rack. The filler module can be used to protect the active module from damage and to prevent the active module from being removed from its position on the rack if it is hit or dropped.

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Description

[Product description] :IC694ACC310 empty slot filling module DCS analog

Manufacturer :GE

Product model :IC694ACC310

Product type:IC694ACC310 empty slot filling module DCS analog

[details]IC694ACC310 empty slot filling module DCS analog

The IC694ACC310 Fanuc is an empty slot filler module built by B for GE RX3i PacSystem. GE RX3i PacSystem is a high performance control system consisting of modules that support the PacSystem engine. This rack-based system is built on the PCI standard to provide fast, consistent control between modules.

The empty IC694ACC310 module is primarily used for decorative purposes, as a placeholder or filler on the rack-based system of GE RX3i PacSystem. Modules can be filled with multiple blank slots on a rack to form a complete module rack. The filler module can be used to protect the active module from damage and to prevent the active module from being removed from its position on the rack if it is hit or dropped.

By filling empty slots IC694ACC310 on the rack, it protects the slots from damage if liquid spills occur on the rack. If a single slot module is damaged, the electronics of the damaged module can be removed from its housing and placed in the IC694ACC310 to restore full operation.

Other modules included in the GE RX3i PacSystem are temperature control module, thermocouple, I/O module, resistive I/O module, local and remote I/O expansion module, pneumatic module, power measurement module, coprocessor communication module, serial communication module, strain gauge I/O module, RTD I/O modules, millivolt I/O modules, analog hybrid I/O modules (input and output), discrete I/O modules, and reflective memory interface modules for personal computing systems.

Shipping weight: 3.5kgThis article is from the official website of Zhangzhou Branch of Xiamen Xiongba E-commerce Co., LTD. Please attach this link:www.sauldcs.com

IC694ACC310

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Please contact Sunny sales@xiongbagk.cn for the best price.

➱ sales manager: Sunny
➱ email mailto: sales@xiongbagk.cn
➱ Skype/WeChat: 18059884797
➱ phone/Whatsapp: + 86 18059884797
➱ QQ: 3095989363
➱ Website:www.sauldcs.com