0010-47763 Assy ESC Bonded Monopolar Dual Heated

Hold and support wafers: In semiconductor manufacturing, ESC is used to hold and support wafers to avoid movement of wafers during processing.

Electrostatic adsorption: ESC uses the Coulomb attraction of capacitive two charged plates to hold the wafer, and this contactless chuck method solves the wafer edge uniformity and particle problems of mechanical chucks.

Temperature control: During wafer processing, ESC can adjust the temperature of the wafer and improve the uniformity of temperature, which is especially important for process steps such as etching.

Improved heat transfer efficiency: The helium flow between the back of the wafer and the surface of the ESC is an important medium for heat transfer, and the ESC firmly absorbs the wafer by increasing the heat transfer between the wafer and the suction cup.

Reduced particle production: The use of ESC reduces wear between the wafer and the chuck, thereby reducing the production of tiny particles that can affect the back of the wafer and be passed on to different process steps.

0010-47763

Suitable for high resistance and large warped wafers: Some types of ESCs are designed to absorb wafers with high resistance materials and/or large warped substrates, solving the problem of poor adsorption of traditional ESCs on such wafers.

Multi-temperature zone control: Some ESC designs include both primary and secondary heaters to enable multi-temperature zone control, which is important in applications where precise temperature control is required.

Improved reliability and repairability: Some ESCs are designed with low temperature preparation and repairability in mind to extend service life and reduce manufacturing difficulty.

In summary, ESC bonding unipolar dual heating is mainly used for wafer fixation, temperature control and process quality improvement in semiconductor manufacturing process, and is an indispensable key component in semiconductor process.