The input module automatically pairs several

On-board signals available for detailed troubleshooting and verification

Module operating characteristics. Measured within each

Sliced HIU and FIU.

From IMBs to field connectors, input modules contain a large number of

Fault detection and integrity testing. As an input device, all tests are

Execute in non-intrusive mode. Data imported from the IMB is stored in

Redundant error correcting RAM on each slice section of the HIU. receive

Data is voted by each slice. All data transfers include an acknowledgment

Response from receiver.

Between the HIU and FIU, there is a series of optically isolated data links

and motivation. Synchronize datalinks and monitor discrepancies. both

Both FIU and HIU have on-board temperature sensors to characterize

temperature-related issues.

ICS TRIPLEX T8431

T8431 ICS TRIPLEX Applied to the card module of electrical and mechanical equipment