In recent years, embedded processors based on 32-bit MPU have been widely used in all walks of life. It brings rich hardware functions and additional performance to embedded design, representing the mainstream of embedded technology development, and its core is mainly Cortex-A7 and Cortex-A8. With the rapid development of the industrial Internet of Things, embedded systems are evolving in the direction of increasing complexity, and the demand for embedded technology development hardware is also increasing, and design engineers must face new challenges to choose higher performance processors.
Recently, the R & D team of Mir Electronics created new products: MYC-YG2LX core board and development board, this product uses Renesas RZ/G2L series processor industrial application chip, Renesas RZ/G2L based on 64-bit Arm® high-end processor (MPU), the main frequency up to 1.2GHz dual-core Arm Cortex-A55 provides powerful edge computing capabilities, Moreover, it integrates dual gigabit Ethernet, up to 7 serial ports, 2 CANFD and other rich communication interfaces, which can meet the needs of complex communication, provide higher performance solutions for future smarter industrial equipment, and lead the evolution of the industrial market from 32-bit MPU to 64-bit.

SAFT-185-TBC

Renesas RZ/G2L series processors, integrated ARM Cortex-A55 high-performance CPU and ARM Cortex-M33 real-time CPU, including Mali-G31 3D GPU, VPU support H.264 1920*1080@30FPS video codec, With rich multimedia interface MIPI-DSI/RGB/MIPI-CSI/Parallel CSI, support 1080P HD display. Engineers can easily implement high-resolution human-machine interfaces (HMI), embedded vision, embedded artificial intelligence (e-AI) and real-time control, as well as industrial Ethernet connectivity.

Renesas RZ/G2L series processors are equipped with 16-bit DDR4-1600/DDR3L-1333 dynamic random access memory, camera interface (MIPI-CSI/Parallel-IF), display interface (MIPI-DSI/Parallel-IF), and USB2.0 Interface, SDHI interface, CAN interface, Gigabit Ethernet interface, and therefore especially suitable for applications such as entry-level industrial human machine interface (HMI) and embedded devices with video capabilities.

The MYC-YG2LX core plate is welded to the base plate in the form of an SMD patch, and the pin contains a stamp hole and a backing pad. The board adopts 10 layers of high density PCB design, gold sinking process production, independent grounding signal layer, lead free.