onsemi (NASDAQ: ON), a leader in smart power and intelligent perception technology, announced the launch of nine new EliteSiC power integration modules (PIM) that provide bidirectional charging for electric vehicle (EV) ultra-fast DC charging piles and energy storage systems (ESS). The silicon carbon-based solution will offer greater efficiency and a simpler cooling mechanism, significantly reducing system costs and up to 40 percent less size and 52 percent less weight than traditional silicon-based IGBT solutions. The more compact, lighter charging platform will provide designers with all the key building blocks needed to quickly deploy a reliable, efficient and scalable DC fast charging network that can charge an EV battery to 80% in as little as 15 minutes.

According to JD Power’s 2023 Electric Vehicle Considerations study, nearly half of U.S. consumers cite concerns about the ease of charging, the ability to charge quickly, and the ability to ensure that the driving experience is as smooth as that of a traditional internal combustion engine (ICE) vehicle as the reason for not purchasing an electric vehicle. In the United States, the number of electric vehicle charging points needs to quadruple by 2025 and eightfold by 2030 to meet demand and ensure that public charging station resources are more equitably distributed to drivers.

The rapid growth of electricity demand has correspondingly put great pressure on the current power grid, which may lead to grid overload. To alleviate this problem, bidirectional charging has become a key solution to achieve Vehicle-to-Grid (V2G technology, vehicle-to-grid) power supply, which supports both conventional battery charging and the use of electric vehicles as energy storage systems to power homes as needed.

The solution helps enable DC fast charging networks and vehicle-to-grid (V2G) power transmission systems to charge vehicles faster than other charging methods that take hours or even days by addressing access and speed issues.

On Semiconductor offers a comprehensive portfolio of PIM products for key topologies on the market. This gives designers the flexibility to select the right PIM for the power conversion stage in DC fast charging or energy storage system applications. To speed up the design cycle, designers can also generate advanced piecewise linear circuit simulation (PLECS) models with On’s PLECS Model Self-generation tool and apply simulations with the portfolio’s Elite Power simulation tool.

For each module, On uses chips from the same wafer to ensure greater consistency and reliability, so designers do not experience different performance results by using discrete devices from different vendors. In addition to reliability, the module portfolio offers the following benefits:

The third generation M3S SiC MOSFET technology provides ultra-low switching losses and ultra-high efficiency
Key topologies such as multilevel T-neutral clamp (TNPC), half-bridge and full-bridge are supported
Supports a scalable output power range from 25 kW to 100 kW, and supports multiple DC fast charging and energy storage system platforms, including two-way charging
Available in industry standard F1 and F2 packages with a choice of pre-coated thermal interface material (TIM) and crimp pins
Achieve optimal thermal management to avoid system failures due to overheating
All-silicon carbide modules minimize power losses, resulting in energy savings and cost reductions
Provides greater robustness and reliability to ensure continuous and consistent work