中文版
Description
Applied Materials (AMAT) 0190-37519 Precision Process Module
As a certified distributor for Applied Materials equipment, Saulcontrol provides genuine semiconductor manufacturing components with full technical support and 1-year warranty. Our specialized team ensures rapid delivery and compatibility verification for critical fab operations.
Technical Specifications
| Product Model | Applied Materials 0190-37519 |
| Manufacturer | Applied Materials, Inc. |
| Product Type | Semiconductor Process Module Assembly |
| Compatible Platforms | Endura® PVD Systems |
| Operating Pressure Range | 1E-8 to 5E-3 Torr |
| Temperature Stability | ±0.5°C at 350°C |
| Materials Compatibility | Al, Ti, Cu, TiN process-ready |
| Vacuum Integrity | < 5E-9 mbar-l/s leak rate |
| Interface Standards | AMAT CFx, SEMI E142 compliant |
| Power Connections | 4x ISO-KF electrical feedthroughs |
| Purge System | N₂ auto-purge with moisture monitoring |
| Service Life | 1M wafer cycles (typical) |
Main Features and Advantages
The 0190-37519 precision module provides critical process stability for advanced PVD applications. Engineered for ultra-high vacuum integrity with specialized metal seals, it maintains base pressures below 1E-8 Torr for contamination-free deposition. Advanced thermal management ensures uniform temperature distribution (±0.5°C) across 300mm wafer processing, enabling angstrom-level thickness control.
Modular quick-connect design allows field replacement within 4-hour downtime windows, with auto-recognition features for plug-and-play commissioning. Integrated health monitoring tracks component wear and process drift using proprietary sensors compatible with Applied Materials® E3 diagnostics. The platform-agnostic interface provides backward compatibility with Endura® PVD systems manufactured after 2010 while supporting next-generation materials requirements.
0190-15384
Application Areas
Semiconductor Front-End: In advanced logic fabs, the 0190-37519 enables precision barrier/seed layer deposition for sub-7nm copper interconnects. The module’s thermal stability is critical for titanium nitride liner uniformity in high-aspect-ratio structures. For 3D NAND manufacturing, it provides conformal coverage in deep-trench capacitor formations with aspect ratios exceeding 70:1.
Advanced Packaging: The module supports RDL (redistribution layer) metallization in fan-out wafer-level packaging with exceptional adhesion properties. For power semiconductor production, it deposits aluminum contacts with controlled grain structure to minimize electromigration. MEMS fabrication utilizes its low-temperature processing capabilities for stress-controlled metallization on sensitive structures.
Related Products
0190-37518 – High-temperature variant for barrier layer applications
0190-37520 – Multi-target configuration for alloy depositions
0190-76342 – RF bias upgrade kit for improved step coverage
0190-22817</ – Target quick-change assembly compatible with this module
0190-50091 – Shield kit for particle reduction during maintenance
0190-37519-KIT – Service kit with seals and consumables
0190-88765 – Diagnostics module for predictive maintenance
Installation and Maintenance
Installation Preparation: Before installing the 0190-37519, perform vacuum chamber bake-out to achieve <5E-7 Torr background pressure. Handle with certified cleanroom gloves using AMAT-approved fixtures. Verify tool calibration status and purge gas moisture levels (<10 ppb). For systems using the 0190-76342 RF kit, pre-align impedance matching networks offline.
Maintenance Suggestion: Perform quarterly helium leak checks at all sealed interfaces. Monitor particle counts through integrated sensors and compare against 0190-88765 diagnostic module baselines. Replace target assemblies after 750k wafer cycles or when erosion patterns reach critical zones. Maintain nitrogen purge during all maintenance activities to prevent moisture adsorption in the 0190-37519 chamber components.
Product Support
Saulcontrol guarantees genuine Applied Materials® components with 1-year performance warranty. Our semiconductor specialists provide installation supervision and process optimization services. Technical documentation includes SEM-compatible qualification protocols and vacuum integrity test reports. Email our technical team for rapid response on fab-critical replacements with same-day shipping options.
Contact Our Engineers:
WhatsApp: +86 180 5988 4797
Email: sales@saulcontrol.com
Phone: +86 181 5089 9970
Please contact Sunny sales@xiongbagk.cn for the best price.
➱ sales manager: Sunny
➱ email mailto: sales@xiongbagk.cn
➱ Skype/WeChat: 18059884797
➱ phone/Whatsapp: + 86 18059884797
➱ QQ: 3095989363
➱ Website:www.sauldcs.com
