Description
Product details:
Slot Covers
All unused slots in the case should be filled with blank I/O slot panels (Model 8105) to maintain proper air flow
Thermal management
Integration engineers must be fully prepared for thermal management when installing Tricon chassis into ventilated or unventilated enclosures.
Triconex recommends baffle installation (Triconex Part number 2000361-001), see page 23.
At temperatures above 122°F(50°C), other thermal management regulations must be implemented, such as:
• Louvers and tower tops
• Enlarged front and rear louvers with raised pagoda tops
• Low density filter
• Redundant fans (running all the time) on appropriate louvers and pagodas
• Fault detection circuit
Mechanical Specifications
These specifications apply to Main, Expansion and RXM Chassis; Power
Supply Modules; and other modules where indicated.
Overall Dimensions 19 in wide by 22.75 in high by 17.75 in deep
(48.3 cm by 57.8 cm by 45.1 cm)
Chassis Fabrication Black zinc-plated and welded cold-rolled steel
Approximate Weights
Main or Expansion Chassis 54.0 lbs. (24.5 kg.)
Power Module 7.2 lbs. (3.3 kg.)
Main Processor 4.7 lbs. (2.1 kg.)
I/O Module 4.7 to 6.0 lbs. (2.1 kg. to 2.7 kg.)
HART Interface Module 4.8 lbs. (2.2 kg.)
Communication Module 5.0 lbs. (2.3 kg.)
16-point Termination Panel .09 lbs. (.04 kg.)
32-point Termination Panel 2.1 lbs. (.95 kg.)
Main Chassis, High-Density Configuration, includes the Tricon printed manuals 8110
Expansion Chassis, High-Density Configuration 8111
Expansion Chassis, Enhanced Low-Density Configuration 8121
Remote Expansion Chassis, High-Density Configuration 8112
I/O Bus Expansion Cables (Set of 3) 9000
I/O-COMM Bus Expansion Cables (Set of 3) 9001
Blank I/O Slot Panel 8105
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TRICONEX 1600071-001 Network communication card |
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