3BHL000391P0101 5SHX 1445H0001 IGCT MODULE

Reliability of IGCT applications
In practical application, reliability is an important index to measure the power electronic device. The fewer discrete components used in the device, the higher the reliability. Reliability is generally expressed in terms of failure rate (FIT), which depends on many factors such as number of chips, bonding lines, weld quality, junction terminal structure, operating temperature, mechanical and electrical stresses, etc. The typical inherent failure rate for a single semiconductor chip is 10FIT (i.e., 10 failures during the operation of the 109 device). The gate itself contains a number of active and passive components with a failure rate of about 500FIT. Inverters with different components have different failure rates. Table 1-12 shows a comparison of Gtos, IGBTs, and IGCTs for high power inverters (3MVA /600Hz). It can be seen that IGCT is superior to GTO and IGBT in reliability, loss, mass, volume, thermal cycle capacity, modularity level and other indicators.